WELCOME TO THE BOSTIK ASIA PACIFIC BLOG

Bostik launches next-generation pad attachment adhesive Kizen™ PAD to enable greater sustainability for the disposable hygiene market

Working with difficult-to-bond surfaces – Solutions to be presented at APPP EXPO 2025

Bostik’s acquisition of Dow’s flexible packaging lamination adhesive business – What’s the impact on our Asia Pacific market?

2024 and Beyond: Trends Driving The Rise in Demand for Adhesives In Asia Pacific

Inside Mobility: Bostik’s Vision for a Sustainable Automotive Future

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