WELCOME TO THE BOSTIK ASIA PACIFIC BLOG

Introduction to the Bostik ADCOTE™ series – the go-to solution for high-performance packaging adhesives

Bostik Born2Bond™ Ultra K85 Makes Its Asia Debut at Productronica 2025

Bostik launches next-generation pad attachment adhesive Kizen™ PAD to enable greater sustainability for the disposable hygiene market

Working with difficult-to-bond surfaces – Solutions to be presented at APPP EXPO 2025

Bostik’s acquisition of Dow’s flexible packaging lamination adhesive business – What’s the impact on our Asia Pacific market?

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