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The Bostik MOR-FREE™ solventless adhesive series – where sustainability meets performance

BOSTIK PARTNERS WITH MITU SHOWCASES SMART ADHESIVE INNOVATIONS FOR INSULATING GLASS AT CHINAGLASS 2025

DISCOVER THREE FEATURES OF BOSTIK BORN2BOND™ ULTRA K85

Introduction to the Bostik ADCOTE™ series – the go-to solution for high-performance packaging adhesives

Bostik Born2Bond™ Ultra K85 Makes Its Asia Debut at Productronica 2025

Working with difficult-to-bond surfaces – Solutions to be presented at APPP EXPO 2025

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