WELCOME TO THE BOSTIK ASIA PACIFIC BLOG

Overcoming adhesion challenges on difficult-to-bond surfaces

Bostik will showcase total solutions for label applications at Labelexpo India 2024

Enabling sustainable and efficient bookbinding processes

Beyond Bonding: Addressing the Challenges of Flexible Packaging with Adhesives

Latest News

More

GET ASIA PACIFIC NEWS ABOUT BOSTIK

Fill in your email address to get our latest news and updates

  •  Download More

  •  Smart Adhesives for Graphics and Specialty Films -- MEETING THE DEMANDS FOR DIFFICULT-TO-BOND SURFACES

  •  Born2Bond™ Ultra K85 -- 60% Bio-based instant adhesive with revolutionary durability

  •  Bostik Kizen™ SPINE and Kizen™ SIDE

  •  Bostik Kizen™ PAD Next-Generation Feminine Hygiene Adhesive

  •  Bostik P100 The Next Generation of Insulating Glass Sealants

  •  Total Solutions for Non-Woven Products

  •  Smart Seal, Good Feel - LEADING-EDGE HOT MELT SEALANTS FOR INSULATING GLASS UNITS

  •  Flexible packaging--SMART, SAFE SOLUTIONS FOR FLEXIBLE LAMINATION

  •  Bostik's Smart Adhesives for Engineering Construction and Home Decoration

  •  Engineering Adhesives for Consumer & Automotive Electronics

    • Corporate News
    Durable Goods
    Packaging
    Hygiene

    CONTACT US

    E-mail：IAAsia.Marcom@bostik.com

    LEAVE MESSAGE

    By submitting this form, I am opting-in to receive marketing communications regarding Bostik and the Arkema Group products, services, and events. Additionally, I allow Bostik and the Arkema Group to store and to use my personal data in order to process and follow my request. (Access our Privacy Policy)

    Copyright © 2021-2024 Bostik China

    Adhesive solutions by Arkema

    TOP