Bostik China Wechat
Thank you for your subscription for Bostik Asia Pacific Blog!
You’ll receive our latest APAC news of Bostik industrial adhesive soon.
Thanks for getting in contact, we will review your message and respond as soon as we can!
The world of consumer electronics is growing larger – by becoming smaller. Consumers clamour for smaller, thinner, and lighter devices yet want them faster, more prolific and with even greater processing power. Such demands are seeing manufacturers working at the speed of light to continuously improve on their product offerings. However, the smarter the device the more complex the mechanisms that are required to run these devices efficiently. Manufacturers are also challenged to not only ensure that these sensors can be housed safely and securely in a minute package but that the aesthetics of the devices are not compromised in the process.
Technology made by small parts
This is where high-tech adhesives enter the picture. High-tech adhesives not only bond the external body of the equipment itself but also help bond and seal optical, mechanical, and electrical sensors. Adhesives not only facilitate miniaturisation, but also increase performance and improve smart device functionality and reliability. As designs get miniaturised and more compact, the need to protect sensitive mechanical parts housed in the device becomes critical. The adhesives need to be able to withstand extreme environmental factors – from extreme heat to extreme cold as well as exposure to chemicals.
High-tech adhesives are developing in tandem with the growth of consumer electronics, with emerging technologies like Low Pressure Moulding (LPM) technology and the use of Thermal Interface Materials (TIM).
Bostik has always prided itself on its ability to understand their customers’ unique performance and process requirements. It is this proactive mindset that has led it to be a pioneer in the development of LPM technology. Bostik’s LPM solutions include the comprehensive and multipurpose Thermelt range. These hot melt polyamide adhesives have high resistance to temperature and oil and offer easy processability at low pressure and low temperatures. These qualities allow the Thermelt adhesives to encapsulate the most fragile and sensitive electronics in the most demanding of environments, making them ideal in protecting and sealing components like connectors, onboard electronics, LEDs and printed circuit boards (PCBs) against moisture, dust and dirt. The lightweight and sky-lining design with no housing needed assures manufacturers that the aesthetics of their products are not compromised.
Bostik’s LPM solutions also include the reactive polyamides (PAR) formulations that can withstand temperatures up to 200°C, offering better cohesion and higher thermal stability. As LPM solutions are solvent-free and bio-based up to 80%, there is zero waste due to its recyclable excess material and long shelf life with improved end-of-life management. Thus, manufacturers are assured that they are working with high performing, safe and non-toxic sustainable solutions made with environmentally friendly materials.
As Bostik is constantly looking to offer viable products to their partners in the electronic market, a key area they are developing is the use of TIMs in electronics manufacturing. As fast charging for e-mobility becomes trendier, the importance of thermal management and TIMs is increasing significantly. As devices are scaled smaller, heat sinking elements become too bulky for use in these devices, thus the use of TIMs is an elegant solution to alleviate heat dissipation in electronics.
The XPU TCA 202 is a two-component, polyurethane-based adhesive designed for heat dissipation in battery pack assemblies. The most stringent of regulations is met with the low-monomer content. The product’s advantage also lies in its easy product handling without specific training, as well as its speedy and ease of process through automatic mixing, dosing, and dispensing equipment. Thermal conductivity is balanced with high mechanical strength while good levels of flexibility is maintained due to high elongation. The adhesive adheres well to most substrates without using a primer, and cures at room temperature.
For more information, please visit at:www.bostik.com