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Engineering Adhesives, BORN2BOND™, Light Lock,
As the world moves at light speed towards a technologically driven future, demand for products that are more compact, more portable, more precise become the norm. This is especially so in the electronics industry for commodities like mobile devices, digital cameras, augmented reality headsets, amongst others. We want to be connected faster - with a single touch. We want to be unencumbered - and not bogged down by bulk. We want to look good - while carrying on our daily activities.
These demands have seen the electronics industry transform at lightning speed. Innovative products that answer the calls for smarter, smaller, speedier. While manufacturers strive towards these new heights, there is also the conundrum of putting everything together - without compromising functionality, quality, and aesthetics. To fulfil these requirements, not only are parts becoming more minute, but various materials are also put together to create one item - metal parts need to be adhered to plastic components, and the finished products need to look sophisticated and polished. Thus, manufacturers need to ensure that the adhesive they use can help them achieve their manufacturing objectives.
While manufacturers do have options for adhesions that they can use in their manufacturing, many look to cyanoacrylates due to its ability to fix in seconds and cure completely in hours. The adhesive’s capacity to adhere a wide variety of substrates together also lends to its attractiveness to manufacturers. Whilst cyanoacrylates beckoned with its adhesive properties, there were also limitations, such as limited competence in gap filling, odours and blooming.
However, necessity is the mother of invention. And the adhesive industry rose to the challenge. Research into maintaining the advantages of cyanoacrylates while looking to eliminate its limitations has seen a revolution in adhesive technology. Light cure cyanoacrylates are able to do away with the issues of odours and blooming and even enhanced its gap filling capabilities.
What these advances mean for manufacturers is the expansion of their assembly abilities. Production can be accelerated to the rapid curing speed of the adhesive. The ability to bond various substrates like metal, plastic and rubber allows for more creative design options, and the eradication of blooming issues is significantly raising the possibilities of producing products that are more aesthetically superior and thereby increasing the value of these items.
As a leader in the adhesives solutions industry, Bostik has always prided itself as a partner who is always cognisant of their customers’ needs and is always keeping up to date on the latest technology to innovate adhesives that will not only meet but surpass their customers’ requirements. The Born2Bond™ Light Lock is Bostik’s solution to enhanced bonding applications.
As a formulation that allows for long open time without activation, its application accuracy is increased, with such precision bonding being a boon for electronics assembly. As less adhesive is required for dispensing and the dual-cure technology enables assembly of multiple substrates simultaneously, allowing manufacturers to run productions that are more time and cost efficient. Light Lock’s gap filling abilities up to 10mm and its multi-substrate adhesion makes it the best possible adhesive for creating electronic products that are not only durable but has high aesthetic value.
For more information, please visit us at Born2Bond.Bostik.com
For more information, please visit us at: www.bostik.com
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